Quick Takeaways
- Ceva and NXP are strengthening the real-time AI backbone of next-generation software-defined vehicles.
- The S32 platform now gains low-latency AI and signal processing for safer, smarter, more efficient cars.
Recently, Ceva SensPro AI DSP was officially integrated by NXP Semiconductors into its S32Z2 and S32E2 automotive processors, marking an important step for software-defined vehicles. Announced at CES 2026, this move strengthens real-time computing and intelligence inside next-generation domain and zonal control units.
Ceva confirmed that Ceva SensPro AI DSP is now embedded in NXP’s S32Z2 and S32E2 platforms, which are designed to power real-time automotive control architectures. These processors act as the digital backbone for modern SDVs, handling safety-critical and performance-critical workloads across multiple vehicle domains.
How Ceva SensPro AI DSP enhances SDV performance
By integrating Ceva SensPro AI DSP, NXP’s processors gain advanced real-time AI inference and signal processing capabilities. This allows vehicle control systems to analyze data streams from multiple sensors with minimal latency, supporting faster and more reliable decision-making inside software-defined vehicle platforms.
Key capabilities enabled by this integration include:
Ceva SensPro AI DSP powering smarter vehicle functions
With Ceva SensPro AI DSP running on the S32Z2 and S32E2 chips, automakers can deploy more intelligent and adaptive vehicle features. These processors support functions that require continuous monitoring, prediction, and rapid response in real-world driving conditions.
Major applications supported by this technology include:
Strengthening the foundation of software-defined vehicles
The integration of Ceva SensPro AI DSP into NXP’s automotive processors provides a scalable foundation for real-time domain and zonal control modules. These modules are critical for consolidating vehicle electronics, reducing wiring complexity, and enabling software-driven upgrades throughout a vehicle’s lifecycle.
By combining Ceva’s AI-optimized digital signal processing with NXP’s automotive-grade S32 platforms, vehicle manufacturers can build SDVs that are more efficient, intelligent, and responsive, setting the stage for next-generation mobility experiences.
Ceva confirmed that Ceva SensPro AI DSP is now embedded in NXP’s S32Z2 and S32E2 platforms, which are designed to power real-time automotive control architectures. These processors act as the digital backbone for modern SDVs, handling safety-critical and performance-critical workloads across multiple vehicle domains.
How Ceva SensPro AI DSP enhances SDV performance
By integrating Ceva SensPro AI DSP, NXP’s processors gain advanced real-time AI inference and signal processing capabilities. This allows vehicle control systems to analyze data streams from multiple sensors with minimal latency, supporting faster and more reliable decision-making inside software-defined vehicle platforms.
Key capabilities enabled by this integration include:
- Real-time AI inference for safety and vehicle control
- Predictive analytics for component and system behavior
- Intelligent energy management across vehicle domains
- High-accuracy sensor and signal processing
Ceva SensPro AI DSP powering smarter vehicle functions
With Ceva SensPro AI DSP running on the S32Z2 and S32E2 chips, automakers can deploy more intelligent and adaptive vehicle features. These processors support functions that require continuous monitoring, prediction, and rapid response in real-world driving conditions.
Major applications supported by this technology include:
- Extending battery life through predictive energy optimization
- Enabling predictive maintenance for key vehicle systems
- Supporting advanced driver monitoring capabilities
- Powering in-cabin voice-controlled human–machine interfaces
Strengthening the foundation of software-defined vehicles
The integration of Ceva SensPro AI DSP into NXP’s automotive processors provides a scalable foundation for real-time domain and zonal control modules. These modules are critical for consolidating vehicle electronics, reducing wiring complexity, and enabling software-driven upgrades throughout a vehicle’s lifecycle.
By combining Ceva’s AI-optimized digital signal processing with NXP’s automotive-grade S32 platforms, vehicle manufacturers can build SDVs that are more efficient, intelligent, and responsive, setting the stage for next-generation mobility experiences.
Company Press Release
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