Quick Takeaways
- Two major technology streams—automotive display ICs and thermal sensing—are converging to elevate digital cockpit intelligence and safety.
- Semiconductor innovation is increasingly shaping next-generation HUDs, driver awareness, and in-vehicle user experience.
Recently, automotive display IC technologies took center stage as Himax Technologies, Inc. confirmed its participation at CES 2026, where it will showcase a comprehensive portfolio of advanced semiconductor solutions. The company plans to highlight innovations designed to support the rapidly evolving requirements of digital cockpits, with a strong emphasis on automotive-grade display performance, efficiency, and integration.
At the core of the showcase will be the company’s automotive display IC portfolio, which is widely used across next-generation vehicle displays. These solutions are engineered to support higher resolution, improved brightness control, and enhanced reliability, aligning with OEM demand for immersive and information-dense in-vehicle displays that enhance driver awareness and user experience.
Automotive Display IC Focus on HUD Tcon Solutions
A key highlight will be advanced Tcon solutions tailored for automotive head-up displays. As HUDs evolve from basic speed indicators to full-featured projection systems, automotive display IC architectures are being optimized to manage complex graphics, real-time data, and multi-layer image processing. These Tcon solutions are designed to support:
By addressing these requirements, automotive display IC solutions play a critical role in enabling safer, more intuitive HUD implementations across passenger and commercial vehicles.
CMOS-Based Thermal Sensing Expands Automotive Applications
In addition to display technologies, the company will also introduce a next-generation CMOS imager-based optical thermal sensor solution developed in collaboration with Calumino. This solution is designed to meet diverse sensing and imaging needs, with applications extending from Industrial IoT and healthcare to automotive systems.
Within the automotive context, such thermal sensing technologies can support advanced driver monitoring, predictive maintenance, and enhanced safety functions. The integration of CMOS imaging with thermal sensing enables compact designs, improved accuracy, and scalability across multiple vehicle platforms, reinforcing the growing role of semiconductor innovation in modern mobility ecosystems.
At the core of the showcase will be the company’s automotive display IC portfolio, which is widely used across next-generation vehicle displays. These solutions are engineered to support higher resolution, improved brightness control, and enhanced reliability, aligning with OEM demand for immersive and information-dense in-vehicle displays that enhance driver awareness and user experience.
Automotive Display IC Focus on HUD Tcon Solutions
A key highlight will be advanced Tcon solutions tailored for automotive head-up displays. As HUDs evolve from basic speed indicators to full-featured projection systems, automotive display IC architectures are being optimized to manage complex graphics, real-time data, and multi-layer image processing. These Tcon solutions are designed to support:
- High refresh rates for smooth visual output
- Precise timing control for projection accuracy
- Compatibility with information-rich cockpit environments
By addressing these requirements, automotive display IC solutions play a critical role in enabling safer, more intuitive HUD implementations across passenger and commercial vehicles.
CMOS-Based Thermal Sensing Expands Automotive Applications
In addition to display technologies, the company will also introduce a next-generation CMOS imager-based optical thermal sensor solution developed in collaboration with Calumino. This solution is designed to meet diverse sensing and imaging needs, with applications extending from Industrial IoT and healthcare to automotive systems.
Within the automotive context, such thermal sensing technologies can support advanced driver monitoring, predictive maintenance, and enhanced safety functions. The integration of CMOS imaging with thermal sensing enables compact designs, improved accuracy, and scalability across multiple vehicle platforms, reinforcing the growing role of semiconductor innovation in modern mobility ecosystems.
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