Quick Takeaways
- AI compute expansion enables automakers to add intelligence without redesigning vehicle architectures.
- External AI modules accelerate autonomous and SDV readiness across new and facelifted models.
On December 24, BOS Semiconductors, a fabless semiconductor company focused on automotive and physical AI solutions, announced its participation at CES 2026 in Las Vegas, where it will introduce its BOS Semiconductors AI Box developed for next-generation mobility applications. The company plans to demonstrate how scalable AI computing can be integrated into vehicles with minimal architectural disruption.
BOS Semiconductors AI Box Aligned with Key Mobility Trends
AI Box Powered by Eagle-N AI Accelerator
The BOS Semiconductors AI Box will be demonstrated through AI model use cases running on the Eagle-N high-performance AI accelerator. Designed as an external AI computing module, the AI Box enables automakers to add an advanced AI processing layer without replacing existing in-vehicle infotainment systems. This approach supports rapid AI capability expansion while limiting changes to current vehicle platforms.
Flexible Integration for Efficient Vehicle Architectures
Engineered for adaptability, the BOS Semiconductors AI Box connects to existing vehicle systems through multiple interfaces. This flexibility supports a clear separation of computing roles within the vehicle, enabling a more efficient AI-centric architecture. Such modular integration simplifies system upgrades and reduces engineering complexity.
Faster AI Adoption Across New and Updated Vehicle Models
By allowing AI capabilities to be added externally, the BOS Semiconductors AI Box supports deployment across both new vehicle programs and facelifted models. Automakers can enhance vehicle design and functionality while shortening development timelines and lowering overall costs, making advanced AI features more accessible across broader vehicle lineups.
BOS Semiconductors AI Box Aligned with Key Mobility Trends
- At CES 2026, BOS Semiconductors will present its technology roadmap aligned with major automotive industry shifts, including the rapid evolution of autonomous driving, the transition toward Software Defined Vehicles, and the growing role of physical AI in vehicle intelligence.
AI Box Powered by Eagle-N AI Accelerator
The BOS Semiconductors AI Box will be demonstrated through AI model use cases running on the Eagle-N high-performance AI accelerator. Designed as an external AI computing module, the AI Box enables automakers to add an advanced AI processing layer without replacing existing in-vehicle infotainment systems. This approach supports rapid AI capability expansion while limiting changes to current vehicle platforms.
Flexible Integration for Efficient Vehicle Architectures
Engineered for adaptability, the BOS Semiconductors AI Box connects to existing vehicle systems through multiple interfaces. This flexibility supports a clear separation of computing roles within the vehicle, enabling a more efficient AI-centric architecture. Such modular integration simplifies system upgrades and reduces engineering complexity.
Faster AI Adoption Across New and Updated Vehicle Models
By allowing AI capabilities to be added externally, the BOS Semiconductors AI Box supports deployment across both new vehicle programs and facelifted models. Automakers can enhance vehicle design and functionality while shortening development timelines and lowering overall costs, making advanced AI features more accessible across broader vehicle lineups.
Company Press Release
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