- Mitsubishi Electric developed new 5th-generation SiC-MOSFET chips for xEV inverter applications.
- The chips deliver approximately 25% lower on-resistance, supporting improved efficiency and compact inverter designs.
Japan-based Mitsubishi Electric announced on June 4 the development of new silicon carbide (SiC) MOSFET chips intended for use in inverters that power drive motors and eAxles in electric vehicles (EVs), plug-in hybrid vehicles (PHVs), and other electrified vehicles collectively categorized as xEVs. The newly introduced devices represent the company’s 5th-generation SiC-MOSFET technology and are designed to address the growing demand for higher efficiency and improved power density in next-generation electrified mobility systems.
The new chips incorporate Mitsubishi Electric’s proprietary trench structure, enabling industry-leading low on-resistance performance. According to the company, the devices achieve approximately 25% lower on-resistance compared with existing products. Lower on-resistance helps reduce power losses during operation, which can contribute to higher energy efficiency and better utilization of electrical power within vehicle propulsion systems. Such improvements are increasingly important as automakers seek to enhance driving range while optimizing overall vehicle performance.
By reducing electrical losses and supporting higher efficiency, the new SiC-MOSFET chips are expected to contribute to the development of smaller and more capable xEV inverters. Compact inverter designs can help vehicle manufacturers improve packaging flexibility while maintaining or enhancing power output characteristics. The technology also supports broader efforts across the electrified vehicle industry to improve energy conversion efficiency and maximize the effectiveness of advanced power electronics systems.
Mitsubishi Electric indicated that the chips are specifically targeted at inverter applications used in drive motors and eAxles, two critical components in modern electrified powertrains. As the adoption of EVs, PHVs, and other xEV platforms continues to expand globally, demand for advanced semiconductor technologies capable of delivering higher efficiency and reliability is expected to increase. Silicon carbide-based devices are increasingly being adopted due to their advantages in high-voltage and high-temperature operating environments.
The company plans to begin sequential shipments of samples for two product variants starting in late June. The sample program will allow customers to evaluate the performance and integration capabilities of the new chips in upcoming electrified vehicle applications. Through this latest development, Mitsubishi Electric aims to support improvements in xEV power efficiency, inverter miniaturization, and vehicle range enhancement while advancing the evolution of automotive power electronics technologies.
Frequently Asked Questions
What are Mitsubishi Electric’s new SiC-MOSFET chips designed for?
The newly developed 5th-generation SiC-MOSFET chips are designed for use in inverters that power drive motors and eAxles in electric vehicles, plug-in hybrid vehicles, and other electrified vehicle platforms. These semiconductor devices help manage power conversion more efficiently within vehicle propulsion systems. By reducing electrical losses and supporting compact inverter designs, the chips can contribute to improved energy efficiency, enhanced vehicle performance, and extended driving range in modern xEV applications.
What is the key advantage of the new 5th-generation SiC-MOSFET technology?
The primary advantage is its approximately 25% lower on-resistance compared with existing products, achieved through Mitsubishi Electric’s proprietary trench structure. Lower on-resistance helps reduce power losses during operation, improving energy efficiency and overall inverter performance. This enables the development of smaller and more efficient power electronics systems for electrified vehicles. The technology also supports better power utilization, which can contribute to longer driving range and improved system-level performance.
When will Mitsubishi Electric start supplying the new chips?
Mitsubishi Electric announced that it will begin sequentially shipping samples of two product types in late June. The sample phase allows automotive manufacturers and system developers to evaluate the chips in real-world inverter and eAxle applications. Customer testing and validation are important steps before broader commercialization. The availability of samples demonstrates the company’s progress in bringing advanced silicon carbide semiconductor technologies to the growing electrified vehicle market.
Click above to visit the official source.