- Infineon is leading the EUR 91 million Moore4Power semiconductor innovation initiative in Europe.
- The project focuses on advanced power electronics using Si, SiC, and GaN integration technologies.
Infineon Technologies AG has announced its leadership role in the Moore4Power research and development initiative, regarded as one of Europe’s largest semiconductor innovation programs focused on advanced power electronics. The project, officially named More than Moore for Disruptive Innovations in Power Electronics, brings together enterprises and research institutions from 15 countries across Europe. With a total investment volume of EUR 91 million, the initiative is scheduled to run for a period of three years and aims to strengthen Europe’s semiconductor technology ecosystem.
Moore4Power Focuses on Advanced Semiconductor Integration
The Moore4Power initiative is centered on heterogeneous integration, a technology approach that combines multiple semiconductor materials and functionalities into highly integrated systems. The project integrates silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies alongside sensing, communication, and control functions. This combination is expected to support the development of highly efficient and scalable power electronics systems suitable for demanding industrial and automotive applications. The project also emphasizes power chiplet technology, which enables modular architectures and more flexible product variants while maintaining globally competitive manufacturing costs.
AI-Assisted Development to Accelerate Semiconductor Innovation
Artificial intelligence-assisted engineering models, digital twins, and automated workflows will play a critical role throughout the Moore4Power project. These technologies are intended to significantly shorten semiconductor development timelines by enabling simultaneous hardware and software design processes. Parallel development methodologies are expected to reduce simulation time while improving engineering efficiency and validation accuracy. By leveraging digitalized workflows, project participants aim to accelerate the deployment of next-generation semiconductor products for power electronics applications across multiple industries.
Digital Product Passport Embedded Into Power Modules
One of the major technological developments within the Moore4Power initiative is the implementation of a Digital Product Passport (DPP) directly into power modules through wireless access functionality. The embedded DPP system is designed to provide important lifecycle information during product operation, including operating conditions, state of health, and estimated remaining lifetime. This capability is expected to improve product monitoring, maintenance planning, and lifecycle management for semiconductor-based power systems while supporting broader digitalization goals within the electronics sector.
Key Highlights of the Moore4Power Project
- Project value stands at EUR 91 million over three years.
- Participants include enterprises and research institutes from 15 European countries.
- Focus areas include Si, SiC, and GaN semiconductor integration technologies.
- AI-assisted development and digital twins will accelerate product engineering cycles.
- Digital Product Passport technology will provide wireless lifecycle monitoring data.
Moore4Power Project Overview
The following table highlights the major details associated with the Moore4Power semiconductor research initiative.
| Category | Details |
|---|---|
| Project Name | Moore4Power |
| Project Leader | Infineon Technologies AG |
| Project Value | EUR 91 Million |
| Duration | Three Years |
| Participating Countries | 15 European Countries |
| Core Technologies | Si, SiC, GaN, AI Models, Digital Twins |
Frequently Asked Questions
What is the Moore4Power semiconductor project?
The Moore4Power project is a large-scale European semiconductor research initiative focused on advanced power electronics technologies and heterogeneous integration systems. Led by Infineon Technologies AG, the EUR 91 million project brings together enterprises and research institutions from 15 European countries. The initiative combines semiconductor materials such as silicon, silicon carbide, and gallium nitride with sensing, communication, and control technologies. It also integrates AI-assisted development tools, digital twins, and digital product passport systems to accelerate semiconductor innovation and improve lifecycle monitoring capabilities.
What technologies are being developed under the Moore4Power initiative?
The Moore4Power initiative focuses on integrating multiple semiconductor technologies into highly efficient and scalable power electronics systems. The project includes silicon, silicon carbide, and gallium nitride semiconductor technologies along with power chiplet architectures, sensing systems, and communication functions. AI-assisted models and digital twins are also being implemented to reduce development time and improve engineering workflows. Additionally, Digital Product Passports embedded into power modules will provide lifecycle data such as operating conditions, state of health, and remaining product lifetime through wireless access systems.
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