- Bosch introduces advanced ultrasonic chipsets enabling real-time AI-based parking and sensing.
- New chips reduce energy consumption, weight, and wiring while improving performance in complex environments.
Robert Bosch GmbH introduced its latest ultrasonic chipsets, TB193 and TB293, at Auto China 2026 in China, targeting significant improvements in close-range perception and AI-driven decision-making. These new-generation chipsets are designed to process ultrasonic data directly at the source, enabling faster and more accurate environmental sensing. By enhancing real-time data interpretation, the technology supports advanced parking and driving applications, particularly in complex urban environments where precision and responsiveness are critical for safe vehicle operation.
Advanced Ultrasonic Processing for AI-Based Parking
The TB193 chipset is engineered to handle high data volumes in real time, achieving system data rates of up to 1.16 Mbps. Meanwhile, the TB293 chip focuses on capturing actual sensor signals with high fidelity. This combination allows vehicles to better interpret surroundings, especially in tight parking areas such as multi-level garages with pillars and confined spaces. The improved sensing capability enhances AI-based parking assistants, enabling more accurate obstacle detection and smoother maneuvering even in challenging layouts.
Enhanced Environmental Detection Capabilities
Beyond parking assistance, the new chipsets extend functionality to road condition detection. By analyzing ultrasonic signals, systems can identify variations such as wet or uneven surfaces. This capability supports smarter braking and driving decisions, contributing to improved safety and vehicle control. The integration of real-time sensing and AI interpretation ensures that vehicles can adapt dynamically to changing road conditions, enhancing both driver confidence and system reliability.
Efficiency Gains in Energy, Weight, and Integration
Bosch’s TB193 and TB293 chipsets are designed with efficiency as a core objective. They consume up to 50% less energy compared to conventional solutions, making them suitable for modern energy-conscious vehicle architectures. Additionally, the reduction in cabling and wiring simplifies system integration while lowering overall component weight by up to 50%. These improvements contribute to more streamlined vehicle designs and support the ongoing shift toward lightweight and efficient automotive systems.
High-Temperature Reliability and Robust Design
The chipsets are capable of operating reliably in demanding thermal environments, withstanding temperatures up to 150°C. This makes them suitable for installation in engine-adjacent areas where heat exposure is significant. The robust design ensures consistent performance under extreme conditions, maintaining sensing accuracy and system stability even in challenging operating scenarios.
Bosch VASI Bus for Flexible Sensor Integration
Alongside the new chipsets, Bosch introduced the VASI bus (Versatile Automotive Sensor Interface), an open interface aimed at increasing flexibility for automakers. This interface allows manufacturers to select sensor suppliers more freely while maintaining compatibility within the vehicle system. By enabling a more modular approach to sensor integration, the VASI bus supports scalable architectures and fosters innovation in automotive sensing technologies.
Key Specifications of Bosch Ultrasonic Chipsets
The following table highlights the core specifications and benefits of the newly introduced chipsets:
Bosch TB193 and TB293 Ultrasonic Chipset Specifications
| Feature | Details |
|---|---|
| Data Processing | Up to 1.16 Mbps real-time processing (TB193) |
| Signal Capture | High-fidelity sensor signal acquisition (TB293) |
| Energy Efficiency | Up to 50% lower energy consumption |
| Weight Reduction | Up to 50% lighter components |
| Operating Temperature | Up to 150°C |
| Integration | Reduced wiring and simplified architecture |
These innovations reflect Bosch’s focus on advancing ultrasonic sensing technology to meet the evolving demands of AI-driven automotive systems. By combining improved performance, efficiency, and flexibility, the TB193 and TB293 chipsets contribute to the development of smarter and more adaptive vehicle functionalities.
Frequently Asked Questions
What makes Bosch TB193 and TB293 chipsets important for modern vehicles?
These chipsets enable real-time ultrasonic data processing and high-accuracy sensing, supporting AI-based parking and driving decisions. They improve detection in tight environments and help identify road conditions like wet or uneven surfaces. Additionally, their reduced energy consumption, lighter weight, and simplified wiring make them highly efficient for modern vehicle architectures. Their ability to operate at high temperatures also ensures reliability in demanding automotive environments, making them suitable for advanced driver assistance systems.
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