Quick Takeaways
- Bosch is leading Europe’s first open chiplet-based automotive hardware platform to accelerate software-defined vehicle (SDV) architectures.
- The initiative strengthens scalable, secure, and modular computing while boosting Europe’s semiconductor collaboration and resilience.
Bosch announced a major step toward next-generation vehicle electronics by leading CHASSIS, Europe’s first open chiplet-based hardware platform dedicated to automotive use. The Bosch chiplet platform for software-defined vehicles is designed to support scalable, secure, and flexible computing architectures aligned with evolving SDV requirements.
Bosch Chiplet Platform Accelerates SDV Architecture Innovation
The Bosch chiplet platform for software-defined vehicles is at the core of a three-year collaborative research program focused on advancing modular semiconductor architectures. Unlike traditional monolithic system-on-chip designs, chiplet-based hardware allows individual functional blocks to be developed, validated, and upgraded independently, improving flexibility and reducing development cycles.
Enabling Scalable and Secure Automotive Computing
Chiplet technology enables automotive manufacturers and suppliers to design computing platforms that scale across vehicle segments and software functions. By separating processing, memory, and specialized accelerators into interoperable chiplets, the architecture supports faster innovation while maintaining high standards for functional safety, cybersecurity, and long-term reliability required in automotive applications.
Key benefits of the chiplet-based approach include:
Strong Industry and Research Collaboration
The initiative brings together 18 partners from across the automotive, semiconductor, software, and research ecosystem. Vehicle manufacturers, tier-one suppliers, chip designers, and research institutions are working together to define open standards and accelerate industrial readiness for chiplet adoption in software-defined vehicles.
Public Support Strengthens European Semiconductor Capabilities
The project receives backing from the Chips Joint Undertaking, along with additional funding contributions from France, Germany, the Netherlands, and the United Kingdom. This coordinated support underlines Europe’s strategic intent to strengthen semiconductor innovation, improve supply chain resilience, and secure leadership in software-defined vehicle technologies.
As vehicles increasingly rely on centralized computing and software-driven functions, the Bosch chiplet platform for software-defined vehicles represents a foundational step toward flexible, future-ready automotive architectures that can evolve alongside rapidly advancing software capabilities.
Bosch Chiplet Platform Accelerates SDV Architecture Innovation
The Bosch chiplet platform for software-defined vehicles is at the core of a three-year collaborative research program focused on advancing modular semiconductor architectures. Unlike traditional monolithic system-on-chip designs, chiplet-based hardware allows individual functional blocks to be developed, validated, and upgraded independently, improving flexibility and reducing development cycles.
Enabling Scalable and Secure Automotive Computing
Chiplet technology enables automotive manufacturers and suppliers to design computing platforms that scale across vehicle segments and software functions. By separating processing, memory, and specialized accelerators into interoperable chiplets, the architecture supports faster innovation while maintaining high standards for functional safety, cybersecurity, and long-term reliability required in automotive applications.
Key benefits of the chiplet-based approach include:
- Modular hardware design enabling faster customization
- Improved scalability for diverse vehicle platforms
- Enhanced security through isolated functional domains
- Reduced dependency on single, monolithic silicon designs
Strong Industry and Research Collaboration
The initiative brings together 18 partners from across the automotive, semiconductor, software, and research ecosystem. Vehicle manufacturers, tier-one suppliers, chip designers, and research institutions are working together to define open standards and accelerate industrial readiness for chiplet adoption in software-defined vehicles.
Public Support Strengthens European Semiconductor Capabilities
The project receives backing from the Chips Joint Undertaking, along with additional funding contributions from France, Germany, the Netherlands, and the United Kingdom. This coordinated support underlines Europe’s strategic intent to strengthen semiconductor innovation, improve supply chain resilience, and secure leadership in software-defined vehicle technologies.
As vehicles increasingly rely on centralized computing and software-driven functions, the Bosch chiplet platform for software-defined vehicles represents a foundational step toward flexible, future-ready automotive architectures that can evolve alongside rapidly advancing software capabilities.
Press Release
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