Infineon ams OSRAM sensor acquisition strengthens automotive and industrial portfolio

ams-OSRAM AG has entered into a definitive agreement to divest its non-optical analog and mixed-signal sensor business to Infineon Technologies AG for EUR 570 million in an all-cash transaction. The Infineon ams OSRAM sensor acquisition reflects a strategic realignment by both companies within the global semiconductor and automotive supply chain.

Transaction scope and structure

The transaction is expected to close in Q2/2026 and is structured as a fabless asset deal. It includes a broad portfolio of sensor products, dedicated research and development capabilities, relevant intellectual property, and associated testing equipment, ensuring continuity of technology and customer support. As part of the agreement, approximately 230 employees will transition to Infineon’s Sensors and Radio Frequency business unit. This transfer is designed to preserve technical expertise and accelerate integration across automotive, industrial, and medical application segments.

Operational and workforce integration

The acquired operations will be absorbed into Infineon’s existing sensor organization, supporting faster product scaling and development efficiency. The move aligns with Infineon’s strategy to deepen its presence in safety-critical and precision sensing solutions.

Strategic impact for both companies

For ams OSRAM, the divestment reinforces its focus on Digital Photonics, with greater emphasis on intelligent optical semiconductor emitters and sensors. This sharper positioning is intended to strengthen long-term competitiveness in high-growth optical and photonics-driven markets. For Infineon, the acquired sensor business is expected to generate approximately EUR 230 million in revenue in 2026. The portfolio expansion enhances Infineon’s capabilities in automotive, industrial, and medical sensing, including applications such as chassis position detection and in-vehicle hands-on sensing, further strengthening its end-to-end sensor offerings across multiple mobility and industrial platforms.