Quick Takeaways
- Autolink AMD automotive E/E architecture brings central computing and zonal integration to next-generation intelligent vehicles.
- The alliance focuses on low-latency data flow, safety-critical intelligence, and scalable vehicle computing platforms.
China-based Wuxi Autolink Intelligence Tech Co., Ltd. has entered into a strategic alliance with U.S. semiconductor leader Advanced Micro Devices, Inc. to accelerate the development of a next-generation automotive electronic/electrical platform. The collaboration centers on the Autolink AMD automotive E/E architecture and its role in future intelligent vehicles.
Consolidating Vehicle Domains Using AMD SoC Platforms
Through this partnership, Autolink has consolidated multiple vehicle domains by leveraging AMD system-on-chip solutions. This approach enables faster in-vehicle data processing, reduces latency across domains, and supports highly reliable intelligent functions that are critical for next-generation cockpit and vehicle systems.
Deep Fusion EEA Integrates Central and Zonal Control
Autolink’s next-generation Deep Fusion EEA introduces a unified architecture that combines central computing, zonal control, and automotive optical communication. This integration represents an industry-first implementation, designed to improve overall vehicle performance while supporting scalable and safety-focused system expansion.
Key capabilities of the architecture include:
Joint Laboratory to Accelerate Automotive AI and HPC
As part of the alliance, Autolink and AMD plan to establish a joint laboratory dedicated to research and development. The facility will focus on high-performance computing, automotive AI platforms, and next-generation vehicle systems, with the goal of fostering open and future-oriented industry ecosystems that support long-term innovation.
By combining Autolink’s automotive system expertise with AMD’s advanced semiconductor technology, the Autolink AMD automotive E/E architecture positions itself as a foundational platform for intelligent, software-defined vehicles.
Consolidating Vehicle Domains Using AMD SoC Platforms
Through this partnership, Autolink has consolidated multiple vehicle domains by leveraging AMD system-on-chip solutions. This approach enables faster in-vehicle data processing, reduces latency across domains, and supports highly reliable intelligent functions that are critical for next-generation cockpit and vehicle systems.
Deep Fusion EEA Integrates Central and Zonal Control
Autolink’s next-generation Deep Fusion EEA introduces a unified architecture that combines central computing, zonal control, and automotive optical communication. This integration represents an industry-first implementation, designed to improve overall vehicle performance while supporting scalable and safety-focused system expansion.
Key capabilities of the architecture include:
- Low-latency, high-bandwidth data transmission
- Centralized compute with zonal execution
- Enhanced functional safety for intelligent applications
Joint Laboratory to Accelerate Automotive AI and HPC
As part of the alliance, Autolink and AMD plan to establish a joint laboratory dedicated to research and development. The facility will focus on high-performance computing, automotive AI platforms, and next-generation vehicle systems, with the goal of fostering open and future-oriented industry ecosystems that support long-term innovation.
By combining Autolink’s automotive system expertise with AMD’s advanced semiconductor technology, the Autolink AMD automotive E/E architecture positions itself as a foundational platform for intelligent, software-defined vehicles.
Company Press Release
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