- Desay SV UWB Sensing Solution enters L9 production.
- Single-chip platform combines digital key and radar.
- Solution removes bumper openings while improving sensing.
Desay SV UWB Solution Enters Li Auto L9 Production
Desay SV UWB Sensing Solution has entered mass production on Li Auto’s all-new L9, a flagship SUV positioned for the embodied intelligence era. The technology was jointly developed by Huizhou Desay SV Automotive Co Ltd, Li Auto Inc, and NXP Semiconductors NV. The system uses ultra-wideband near-field sensing fusion to combine digital-key and radar capabilities within a multi-purpose single-chip platform. Its production deployment brings several vehicle functions together while simplifying the underlying hardware architecture, marking a move toward more integrated sensing and access technologies within the L9 platform.
Multi-Function Platform Integrates Digital Key And Radar
The solution combines digital key and radar capabilities while supporting several functions through the same platform. These include digital key operation, low-power sentry mode, child presence detection, kick sensing, and parking assistance. By consolidating these capabilities, the architecture reduces the need for separate hardware components and avoids openings in the vehicle bumpers. The sensing system also provides a wider field of view and uses high-precision UWB angle measurement. This combination is designed to improve the detection of small suspended objects while supporting more stable performance across demanding environmental conditions that can challenge near-field sensing systems.
UWB Sensing Supports Challenging Environmental Conditions
A key aspect of the technology is its ability to maintain stable operation when environmental conditions change significantly. The system is designed to operate reliably during rain and snow as well as under substantial fluctuations in temperature and humidity. Its wider field of view and precise UWB angle measurement contribute to the detection capability, particularly when identifying small suspended objects. These characteristics allow multiple sensing-related functions to operate through an integrated architecture rather than relying on separate systems with individual hardware requirements. The approach can therefore support a cleaner vehicle design while maintaining the sensing capabilities required for digital access, monitoring, presence detection, and parking-related applications.
Collaboration Defines Responsibilities Across The Technology Stack
The development involved clearly divided responsibilities among the three companies. Li Auto led the definition of the vehicle architecture and the design of the user experience, establishing how the technology would be incorporated into the vehicle and experienced by occupants. Desay SV handled system integration design, application development, and engineering implementation, translating the requirements into a production-ready solution. NXP supplied the chips and underlying technology support needed for the platform. The collaboration therefore combined vehicle-level architecture and user-experience expertise with system engineering, application development, semiconductor technology, and implementation capabilities.
Industry Impact & Outlook
The mass-production deployment demonstrates the practical value of integrating access, radar, and near-field sensing functions into a common vehicle platform. For automakers, suppliers, and semiconductor providers, this approach can reduce hardware complexity while supporting several user-facing and safety-related functions through a more consolidated architecture. The L9 application also provides a production example of UWB technology being used beyond digital-key functionality alone, with sensing capabilities extending into presence detection, kick sensing, and parking assistance. Future development will depend on how effectively similar integrated architectures can address vehicle packaging, environmental reliability, sensing performance, and broader feature requirements across additional vehicle programs.
Frequently Asked Questions
What is the Desay SV UWB sensing solution used on the Li Auto L9?
The solution is a multi-purpose single-chip platform that combines digital-key and radar capabilities for several vehicle functions. It supports digital key, low-power sentry mode, child presence detection, kick sensing, and parking assistance while simplifying vehicle hardware architecture. The system uses a wider field of view and high-precision UWB angle measurement to improve detection of small suspended objects and maintain stable operation in rain, snow, temperature changes, and humidity fluctuations. Li Auto led vehicle architecture and user-experience work, Desay SV handled integration and engineering, and NXP provided semiconductor and underlying technology support.
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