- China Automotive Semiconductor Supply Manual officially released.
- Manual covers more than 500 automotive products.
- Robotics manual includes more than 150 products.
China Releases 2026 Automotive Semiconductor Supply Manual
The China Automotive Semiconductor Supply Manual has been officially released alongside the 2026 Robotics Semiconductor Supply Manual at the 2026 Automotive Chip Industry Innovation Ecosystem Conference. The release was organized through the China Automotive Chip Industry Innovation Strategic Alliance and reflects a coordinated effort involving more than 100 Chinese automotive semiconductor companies. The automotive manual contains more than 500 products across major semiconductor categories, with particular attention to high-computing-power system-on-chips, silicon carbide power devices, and high-functional-safety microcontroller units. The initiative provides a consolidated view of semiconductor products relevant to the country's evolving automotive technology requirements.
Automotive Semiconductor Coverage Expands Across Key Technologies
The 2026 China Automotive Semiconductor Supply Manual focuses on semiconductor technologies needed for increasingly advanced vehicle architectures. Its coverage includes high-computing-power system-on-chips designed for demanding vehicle computing requirements, silicon carbide power devices supporting high-voltage electric powertrains, and microcontroller units with high functional-safety capabilities. These components are increasingly important as automakers develop more centralized electronic architectures and integrate computing functions across vehicles. The manual specifically addresses semiconductor requirements associated with cockpit-driving integration, central computing platforms, and 800V high-voltage electric drivetrains, highlighting the breadth of technologies being incorporated into modern vehicle systems in China.
Manual Targets Centralized Vehicle Computing and 800V Systems
The inclusion of cockpit-driving integration and central computing platforms indicates that the supply manual extends beyond individual semiconductor components toward architectures requiring greater computing concentration and system integration. High-computing-power SoCs are particularly relevant to these architectures because they can support substantial processing workloads within vehicle electronic systems. At the powertrain level, silicon carbide devices are included in response to requirements associated with 800V high-voltage electric drivetrains. High-functional-safety MCUs add another important category by addressing control applications where safety requirements are central to vehicle system design. Together, these categories reflect semiconductor requirements emerging across advanced automotive platforms in China.
Robotics Semiconductor Manual Adds Nearly 50 Companies
The 2026 Robotics Semiconductor Supply Manual broadens the conference's semiconductor supply initiative beyond automotive applications. It brings together more than 150 products from nearly 50 automotive semiconductor companies from China and overseas markets. The manual covers core semiconductor categories required for robotics systems, including main control system-on-chips, motion control microcontroller units, power devices, and sensors. Its inclusion of both Chinese and overseas semiconductor companies provides a broader supplier base for the listed robotics components. The manual therefore complements the automotive-focused publication while addressing semiconductor requirements across control, motion, power management, and sensing functions in China.
Industry Impact & Outlook
The two manuals could improve visibility into available semiconductor products as automotive and robotics developers evaluate increasingly complex computing, control, power, and sensing requirements. For the automotive sector, the emphasis on advanced SoCs, SiC power devices, functional-safety MCUs, centralized computing, and 800V drivetrains aligns the supply landscape with major architectural shifts already identified in the release. The robotics manual similarly expands supplier visibility across core control and sensing components. The practical significance will depend on how manufacturers and technology developers use the listed products in sourcing and system-development decisions, but the initiative strengthens structured semiconductor supply information across these connected technology markets.
Frequently Asked Questions
What does the 2026 China Automotive Semiconductor Supply Manual cover?
The 2026 China Automotive Semiconductor Supply Manual covers more than 500 semiconductor products from over 100 Chinese automotive semiconductor companies across major technology categories. Its focus includes high-computing-power system-on-chips, silicon carbide power devices, and high-functional-safety microcontroller units. The manual also addresses semiconductor requirements for advanced vehicle architectures, including cockpit-driving integration, central computing platforms, and 800V high-voltage electric drivetrains. It was officially released at the 2026 Automotive Chip Industry Innovation Ecosystem Conference alongside a separate robotics semiconductor supply manual.
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