SemiDrive Series C Funding Reaches 1 Billion Yuan in 2026

SemiDrive Raises 1 Billion Yuan Across 2026 Series C Funding

SemiDrive has completed its Series C+ and Series C++ financing rounds, bringing its total Series C funding for 2026 to approximately 1 billion yuan, or about $148 million. The Chinese automotive chip designer said the latest financing attracted Walden International, Shaanxi Investment Fund, Shaanxi Financial Asset Management and Shaanxi New Era Capital, together with other financial and strategic investors. The capital is intended primarily for research and development of core technologies and their commercialization, as SemiDrive seeks to expand its capabilities in smart cockpit and vehicle control chips while extending its automotive-grade technology into embodied artificial intelligence and other intelligent-device applications.

Funding Supports Automotive Chip Technology Expansion

SemiDrive said the newly raised capital will support continued development and commercialization of core semiconductor technologies. The company plans to strengthen its position in smart cockpit and vehicle control chips while broadening its automotive-grade capabilities into emerging applications such as embodied AI and other smart devices. The latest financing represents SemiDrive's second funding announcement in 2026. In May, the company announced that it had completed a Series C financing round of nearly $100 million, adding to the funding secured during the year as it expands its technology portfolio and commercial reach.

SemiDrive Combines Automotive SoCs and MCUs

SemiDrive is one of a relatively small group of chip designers globally offering both automotive-grade system-on-chips and high-performance microcontroller units. Its product portfolio includes the X9 smart cockpit chip, V9 smart driving chip, G9 central gateway chip and E3 high-performance MCU. The company said cumulative shipments across its automotive chip portfolio have now exceeded 14 million units, compared with 12 million units reported in May. Its products are used by more than 90% of Chinese automakers as well as some international manufacturers, demonstrating the breadth of its automotive semiconductor deployment.

Automaker Customer Base Extends Across Major Brands

SemiDrive's customer list includes major automakers such as SAIC Motor, Chery, Changan Automobile, Dongfeng, FAW, Nissan, Honda, Volkswagen and Li Auto. The company said its products have reached more than 90% of automakers in China, while also serving selected international manufacturers. This customer base spans smart cockpit, vehicle control and other automotive semiconductor applications, giving SemiDrive a broad commercial footprint as automakers increase their reliance on locally developed and automotive-grade computing technologies.

SemiDrive Expands Into Embodied AI

Beyond conventional automotive semiconductor applications, SemiDrive is extending its technology into embodied AI. The company said it provides a full-stack chip solution covering what it describes as the “brain, cerebellum, torso and joints” architecture for embodied AI systems. SemiDrive also said its chips are already being used in mass-produced products from leading embodied AI companies. Walden International said SemiDrive ranks first among domestic suppliers by market share in both smart cockpit chips and vehicle control MCUs. The investor also identified the company's expansion from automotive chips into embodied AI as an additional area of growth opportunity.

SemiDrive Builds on Earlier Series B Financing

Founded in 2018 and headquartered in Nanjing, SemiDrive has expanded its financing base through several major funding rounds. The company previously raised 1 billion yuan in a Series B financing round in July 2021, followed by approximately another 1 billion yuan in a Series B+ round in November 2022. The additional Series C financing in 2026 gives the company further capital to pursue technology development and commercialization across automotive semiconductors and emerging intelligent-device applications. The funding progression also accompanies an increase in cumulative automotive chip shipments from 12 million units in May to more than 14 million units.

Industry Impact & Outlook

SemiDrive's expanded funding provides additional resources for developing automotive computing technologies while supporting its move into embodied AI, two areas where semiconductor capabilities are increasingly connected to intelligent vehicle functions. The company's established customer base among Chinese automakers and selected international manufacturers gives its products an existing commercial foundation as it broadens its portfolio. The next phase will center on converting research and development investment into commercially deployed technologies across smart cockpits, vehicle control and embodied AI, with the company's shipment growth providing an important measure of how effectively its expanded technology and financing strategy translates into broader adoption.

Frequently Asked Questions

How much Series C funding has SemiDrive raised in 2026?
SemiDrive has raised approximately 1 billion yuan, or about $148 million, across its Series C financing in 2026. The total includes the company's recently completed Series C+ and Series C++ rounds, as well as its earlier Series C financing announced in May. The company said the latest capital will primarily support research and development of core technologies and their commercialization. SemiDrive also plans to strengthen its smart cockpit and vehicle control chip businesses while expanding its automotive-grade semiconductor capabilities into embodied AI and other intelligent-device applications.