Li Auto Unveils M100 AI Chip With Industry-Leading 2,560 TOPS Computing Power

Li Auto has officially revealed its self-developed M100 smart driving chip, marking a major step in the company’s effort to strengthen its vertically integrated automotive technology ecosystem. The Chinese electric vehicle manufacturer confirmed key specifications of the processor through an official announcement on Weibo, while also stating that the upcoming Li L9 Livis flagship SUV will become the first production model equipped with the new platform. The launch highlights the growing trend among Chinese EV makers to reduce reliance on third-party semiconductor suppliers and accelerate development of intelligent driving systems through proprietary hardware and software integration.

The M100 chip is produced using a 5-nanometer automotive-grade manufacturing process and delivers a maximum single-chip computing performance of 1,280 TOPS. According to the company, this makes it the highest-performance automotive smart driving chip currently available globally. Li Auto also confirmed that its VLA 2.1 large AI model was developed simultaneously alongside the M100 platform, enabling a 40 percent reduction in end-to-end processing latency. The company further claimed that the overall response speed of the system is now twice as fast as normal human reaction time, supporting more advanced autonomous driving decision-making and real-time vehicle perception capabilities.

Li Xiang, founder, chairman, and chief executive officer of Li Auto, stated that the company’s chip program is designed to address technical limitations that existing suppliers have not been able to overcome. He explained that the rapid expansion of artificial intelligence applications is driving fundamental changes in semiconductor architecture requirements. According to Li, the M100 utilizes a dynamic data flow architecture capable of overcoming efficiency bottlenecks commonly associated with traditional chip structures. The executive also compared the company’s strategy to Apple’s vertically integrated development approach, emphasizing synchronized in-house development of chips, operating systems, large models, and vehicle hardware.

The company stated that this combined hardware and software design strategy is intended to improve embodied AI experiences inside vehicles while helping bring artificial intelligence technologies into increasingly complex real-world mobility scenarios. The upcoming Li L9 Livis will feature dual M100 chips, allowing the SUV to achieve a combined computing capability of 2,560 TOPS. This level of processing performance is expected to support more advanced intelligent driving features, high-speed data handling, enhanced sensor fusion, and faster AI-driven decision execution during vehicle operation.

Li L9 Livis Key Specifications and Launch Details

The Li L9 Livis officially entered the pre-sales phase on April 24 with a starting pre-sale price of 559,800 yuan, equivalent to approximately $82,384. The flagship SUV is additionally equipped with a drive-by-wire chassis architecture, reflecting the company’s broader focus on advanced electronic vehicle control systems and next-generation intelligent mobility technologies. Li Auto confirmed that the model is scheduled for its official market launch and customer deliveries on May 15.

Below is an overview of the major specifications and launch information announced for the Li L9 Livis and the M100 chip platform.

The introduction of the M100 also places China-based Li Auto among a growing list of domestic electric vehicle manufacturers pursuing internally developed intelligent driving semiconductors. Nio has already deployed its Shenji NX9031 smart driving chip across all models under its main vehicle brand and has started integrating the processor into products under its Onvo sub-brand. Meanwhile, Xpeng continues expanding the deployment of its Turing chip platform across multiple models as it seeks to strengthen profitability and product competitiveness through differentiated hardware and software offerings.

The accelerating investment in proprietary automotive chips reflects the broader industry shift toward software-defined vehicles, AI-driven mobility platforms, and tighter integration between intelligent hardware and autonomous driving systems. Chinese EV manufacturers are increasingly using custom semiconductor development as a strategy to improve computing efficiency, optimize costs, enhance software compatibility, and create differentiated smart driving experiences in an increasingly competitive market environment.

Frequently Asked Questions

What is the computing power of Li Auto’s M100 chip?
The Li Auto M100 chip delivers up to 1,280 TOPS of single-chip computing performance using a 5-nanometer automotive-grade process. In the Li L9 Livis, two M100 chips are combined to achieve a total computing capability of 2,560 TOPS. According to the company, this enables faster intelligent driving processing, lower system latency, and improved AI-driven decision-making. The platform was also developed alongside Li Auto’s VLA 2.1 large AI model to support advanced autonomous driving functions and real-time vehicle perception systems.

Which vehicle will first use the Li Auto M100 smart driving chip?
The Li L9 Livis flagship SUV will become the first production vehicle to feature Li Auto’s in-house developed M100 smart driving chip. The model entered pre-sales on April 24 with a starting price of 559,800 yuan and is scheduled for official launch and deliveries on May 15. The SUV will use dual M100 processors delivering a combined 2,560 TOPS computing capability while also featuring a drive-by-wire chassis and advanced intelligent driving technologies designed to enhance AI-powered vehicle performance and user experience.