China Automotive Semiconductor Supply Manual Adds 500 Products

China Releases 2026 Automotive Semiconductor Supply Manual

The China Automotive Semiconductor Supply Manual was officially released alongside the 2026 Robotics Semiconductor Supply Manual at the 2026 Automotive Chip Industry Innovation Ecosystem Conference. The automotive manual was jointly compiled by the China Automotive Chip Industry Innovation Strategic Alliance and more than 100 Chinese automotive semiconductor companies. It contains more than 500 products across major semiconductor categories, creating a consolidated reference for automotive semiconductor supply. The publication focuses particularly on high-computing-power system-on-chips (SoC), silicon carbide (SiC) power devices, and high-functional-safety microcontroller units (MCU), reflecting semiconductor requirements associated with increasingly advanced vehicle electrical and electronic architectures.

Manual Targets Advanced Vehicle Architectures

The 2026 manual specifically addresses semiconductor requirements for advanced vehicle architectures, including cockpit-driving integration, central computing platforms, and 800V high-voltage electric drivetrains. These architectures require semiconductor components capable of supporting higher computing performance, functional-safety requirements, and high-voltage power management. By bringing more than 500 products into a single supply manual, the initiative provides coverage across major automotive semiconductor categories while emphasizing technologies identified as important to next-generation vehicle systems. The focus on SoCs, SiC power devices, and MCUs also highlights the breadth of semiconductor functions required across computing, power electronics, control, and vehicle-level electrical architectures in China's automotive sector.

Robotics Semiconductor Manual Expands Component Coverage

The 2026 Robotics Semiconductor Supply Manual was also released at the conference, extending the supply reference beyond conventional automotive applications. It brings together more than 150 products from nearly 50 Chinese and overseas automotive semiconductor companies. The manual covers core robotics semiconductor categories that include main control SoCs, motion control MCUs, power devices, and sensors. Its product coverage demonstrates the overlap between semiconductor technologies used in automotive systems and those required for robotics applications, particularly in computing, motion control, power management, and sensing. The participation of both domestic and overseas companies also gives the robotics manual a broader supplier base while maintaining its focus on core semiconductor components.

Supply Ecosystem Gains Broader Semiconductor Reference

The two manuals provide structured product coverage for semiconductor applications spanning automotive and robotics systems. The automotive publication draws on contributions from more than 100 companies and identifies more than 500 products, while the robotics publication covers more than 150 products from nearly 50 Chinese and overseas suppliers. Together, the releases demonstrate a coordinated effort to organize semiconductor supply information around specific application requirements. For vehicle developers, semiconductor suppliers, and other participants in the technology ecosystem, the manuals can serve as references for components associated with computing platforms, power devices, control units, and sensors. The initiative also connects semiconductor supply considerations with evolving system architectures in China.

Industry Impact & Outlook

The release of the manuals could improve visibility into semiconductor products available for automotive and robotics applications while helping suppliers align their offerings with evolving system requirements. In automotive development, the emphasis on high-computing-power SoCs, SiC power devices, high-functional-safety MCUs, cockpit-driving integration, central computing, and 800V drivetrains points to areas where semiconductor capability is closely tied to vehicle architecture. The robotics manual similarly highlights demand for main control, motion control, power, and sensing components. The immediate significance is the creation of more structured supply references across these application areas, while future value will depend on how manufacturers and technology developers use the listed products within their sourcing and system-development activities.

Frequently Asked Questions

What does the 2026 China automotive semiconductor manual cover?
The 2026 manual covers more than 500 automotive semiconductor products across major categories, with particular emphasis on high-computing-power SoCs, SiC power devices, and high-functional-safety MCUs. It also addresses semiconductor requirements for advanced vehicle architectures, including cockpit-driving integration, central computing platforms, and 800V high-voltage electric drivetrains. The manual was jointly compiled by the China Automotive Chip Industry Innovation Strategic Alliance and more than 100 Chinese automotive semiconductor companies, making it a broad reference for semiconductor products relevant to evolving automotive electrical and electronic systems.