300mm BCD-on-SOI Technology Advances Next-Generation Power Electronics Manufacturing

Soitec and ZenSemi have entered into a strategic collaboration announced on June 25 to accelerate the large-scale production of 300mm BCD-on-SOI Technology for advanced power electronics. As part of the agreement, Soitec will provide its 300mm Power-SOI substrates to ZenSemi, supporting the development of a manufacturing platform intended for both fabless semiconductor companies and integrated device manufacturers (IDMs). The joint effort is focused on delivering a high-performance production solution that addresses evolving market demands across multiple high-value industries.

Collaboration Focuses on High-Volume Semiconductor Manufacturing

The partnership combines Soitec's expertise in Silicon-on-Insulator substrate technology with ZenSemi's semiconductor capabilities to enable commercial-scale manufacturing of 300mm BCD-on-SOI solutions. Bipolar-CMOS-DMOS on Silicon-on-Insulator technology is engineered to support advanced semiconductor designs that require higher performance, improved integration, and enhanced manufacturing efficiency. By making this platform available to fabless companies and IDMs, the collaboration seeks to strengthen access to next-generation semiconductor manufacturing technologies tailored to demanding applications.

Target Applications Across High-Growth Industries

The newly developed 300mm BCD-on-SOI Technology is intended to address the growing performance requirements of several rapidly expanding markets. These include high-efficiency power distribution systems used in AI datacenters, automotive electronics and robotics applications that must satisfy stringent functional safety (FuSa) requirements, as well as battery management systems (BMS) designed for electric vehicles and energy storage systems. The technology supports the increasing need for reliable and highly integrated semiconductor solutions across these sectors.

Advanced Integration and Reliability Benefits

BCD-on-SOI technology plays an important role in improving semiconductor integration while enhancing operational reliability for modern power electronic devices. Its architecture is designed to meet the performance expectations of increasingly complex electronic systems where efficiency, safety, and long-term reliability are essential. Through this collaboration, Soitec and ZenSemi aim to provide a scalable manufacturing platform capable of supporting future semiconductor innovations and the evolving needs of power electronics applications.

Frequently Asked Questions

What is 300mm BCD-on-SOI Technology?
300mm BCD-on-SOI Technology combines Bipolar, CMOS, and DMOS semiconductor processes on Silicon-on-Insulator substrates to enable highly integrated and reliable power electronic devices. The technology is designed for high-volume manufacturing while improving performance, integration, and reliability. It supports demanding applications such as AI datacenter power distribution, automotive electronics, robotics, battery management systems, and energy storage solutions that require efficient and dependable semiconductor performance.

What is the objective of the Soitec and ZenSemi collaboration?
The collaboration aims to establish a high-volume manufacturing platform using Soitec's 300mm Power-SOI substrates to support next-generation power electronics. By combining their respective technologies, the companies intend to provide fabless semiconductor firms and integrated device manufacturers with a production-ready platform capable of meeting increasing market demands for advanced semiconductor solutions across multiple industries, including automotive, AI infrastructure, robotics, and energy storage.